BEIJING, Dec 9 (Reuters) - U.S. President Donald Trump said the United States would allow Nvidia's H200 processors to be exported to China, though it remains unclear whether Beijing will give the ...

The race for memory chips is quietly intensifying across the tech world. As AI data centers require high-tech parts faster and in larger quantities than manufacturers can produce, companies such as ...

The TCP/IP functionality of a connected device uses dynamic RAM allocation because of the unpredictable nature of network behavior. For example, if a device serves a web dashboard, we cannot control ...

TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

Recent progress on deep learning accelerators enabled impressive performance on a wide range of applications. However, deep learning accelerators consume enormous amount of energy when accelerated in ...

There are two pools of memory that are available to you as a C++ programmer: the stack and the heap. Until now, we’ve been using the stack. This video (9:30) explains the difference between the stack ...

JEDEC is still finalizing the HBM4 memory specifications, with Rambus teasing its next-gen HBM4 memory controller that will be prepared for next-gen AI and data center markets, continuing to expand ...

Forward-looking: Major chipmaking companies have been trying to stack different kinds of silicon components onto each other for quite some time. Now, Samsung is apparently ready to debut a significant ...

SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...