Abstract: This letter proposes the use of a chip-on-ceramic heatsink packaging to reduce common-mode (CM) noise at the package level while improving thermal performance for SiC power modules. The ...

This video showcases a JDM drag racing session featuring several high-performance Japanese cars, including powerful Toyota, Nissan, and Honda builds. The footage focuses on acceleration runs, launch ...

Understand how rumored Apple A20 chip upgrades and improved efficiency cores could boost iPhone 18 battery life and iPhone 18 performance efficiency based on early leaks and analysis. Pixabay, kropekk ...

The MacBook Pro 2026 marks a major leap for future Apple MacBooks with the M5 chip, delivering up to 25% faster CPU and GPU performance compared to the previous M4 series. Built on the advanced 2nm ...

A standard reference thermoelectric module (SRTEM) for objectively measuring thermoelectric module performance has been developed in Korea for the first time. A research team led by Dr. Sang Hyun Park ...

San Diego-based startup Kneron Inc., an artificial intelligence company pioneering neural processing units for the edge, today announced the launch of its next-generation KL1140 chip Founded in 2015, ...

OnePlus is gearing up to enhance the Android gaming experience with a newly unveiled Gaming Technology suite. The information comes from the company itself, which announced that its upcoming OnePlus ...

Apple just released three new products with the M5 chip: a base-model MacBook Pro, the iPad Pro with better connectivity capabilities thanks to the N1 and C1X modems, and an updated Apple Vision Pro ...

Apple’s new M5 chip stands out with its performance. The M5 has made a significant leap forward in artificial intelligence (AI) and machine learning (ML) tasks compared to the M4. It stands out with ...

1. Toyota Supra (MK4 / A80 Generation) The Toyota Supra MK4, produced from 1993 to 2002, is widely regarded as one of the most iconic JDM sports cars. Beyond its legendary performance, it has earned a ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...