Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) ...

FREMONT, CA / ACCESS Newswire / November 3, 2025 / Aehr Test Systems (AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced a strategic partnership with ISE Labs, ...

Las Vegas, NV, Jan. 09, 2020 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) ...

Samsung Electronics is advancing development of its next-generation System-on-Panel (SoP) packaging technology, aiming to produce modules significantly larger than those possible with conventional ...

PHOENIX, Oct. 07, 2025 (GLOBE NEWSWIRE) -- SEMICON WEST -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

All ready for 2016 TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016. Apparently the fruity cargo cult… TSMC ...