FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

FREMONT, Calif., Sept. 04, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level ...

New double-sided bevel etching system enhances process efficiency and reliability in copper-related applications, supporting high-precision features on large panels FREMONT, Calif., Sept. 03, 2024 ...

LONDON--(BUSINESS WIRE)--The global fan-out wafer level packaging (FOWLP) market is expected to post a CAGR of almost 16% during the period 2019-2023, according to the latest market research report by ...

ACM’s Ultra C VI Tool Supports Most Semiconductor Clean Processes for Advanced Logic, DRAM and 3D NAND Manufacturing; Provides 50% More Throughput Than 12 Chamber Tool FREMONT, Calif., April 21, 2022 ...

SAN JOSE — A consortium of chip-equipment makers here today announced a major deal with Ace Semiconductor to help set up the world's first wafer-level packaging production line in China. Under the ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

Temporary bonding (TB) and debonding (DB) of wafers have been widely developed and applied over the last decade in various wafer-level packaging technologies, such as package-on-package (PoP), fan-out ...

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel ...

Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its ...

Advanced packaging that’s no bigger than the die itself brings together high performance and high reliability with small size and low cost. Not so long ago, defense and aerospace applications were the ...

Breakthrough yield and device performance at high volume show team can scale company's large-format advanced packaging for customers' cutting-edge applications SINGAPORE, SG / ACCESS Newswire / ...