FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...

FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced its first shipment of the Company’s Dragonfly ® G3 system with the ...

This study investigates creation of 1.0µm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is ...

(Nanowerk News) Imec engineers have, for the first time, demonstrated the fabrication of extremely small sealed cavities (less than one picoliter in volume), fabricated directly on 200mm silicon ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

Selbyville, Delaware, June 26, 2023 (GLOBE NEWSWIRE) -- Fan-Out Wafer Level Packaging Market is set to surpass USD 5 billion by the end of 2032 , as per a recent study by Global Market Insights Inc.

Business may be weak, but packaging technology developments continue to move forward. “Most business stuff is negative, negative, negative, but packaging technology developments are positive,” said ...

Moore’s Law in process technology is on its last legs, so advanced packaging is taking up the baton. Advanced techniques such as fan-out wafer-level packaging (FOWLP) allow increased component density ...