Predicted molecular structure of the coordination complex between silver ions and THPP using DFT calculations, along with electrodeposition behavior of silver coatings for different electrolytes. A ...

RSP Technology applies a fine line screen printed seed layer that is then electroplated with a smooth silver layer, resulting in increased efficiencies at a significantly reduced cost. The bath ...

New phosphorus-based solution enables high-quality plating without toxic materials, simplifying the process for semiconductors and medical devices. From left: Se-il Kim, Senior Researcher at the Korea ...

DuPont de Nemours, Inc. DD recently launched SOLDERON BP TS 7000, the latest innovation in tin-silver plating chemistry, at the IEEE Electronic Components and Technology Conference (ECTC), in Orlando, ...

The solar industry has dragged its heels on the issue of silver-dependence for cell metallization, but China’s Jiangsu Xianghuan Technology (JXTC) is moving into commercial production with a copper ...