Oversubscribed financing round consisting of €77 million in Series C equity capital, led by HV Capital and DTCF, and €23 million in public funding, marking one of the largest capital rounds in the ...

Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO ...

SEOUL, Oct 21 (Reuters) - The global rush by chipmakers to produce AI chips is tightening supply of less glamorous chips used in smartphones, computers and servers, spurring panic buying by some ...