LANDSHUT, Germany & MUNICH--(BUSINESS WIRE)--LFoundry today announced the availability of an OpenAccess (OA) based interoperable process design kit (iPDK) for high performance analog and RF design ...

The latest revision of austriamicrosystems’ analog/mixed signal high performance process design kit (“HIT-Kit”) is now available for its 0.35-?m CMOS, high-voltage CMOS, and SiGe-BiCMOS specialty ...

DENVER, COLORADO / ACCESS Newswire / March 28, 2025 / Lightwave Logic, Inc. (LWLG) (the "Company"), a technology platform company leveraging its proprietary electro-optic (EO) polymers to transmit ...

Fraunhofer Institute for Integrated Circuits (IIS) and Austriamicrosystems Full Service Foundry business unit jointly announced the availability of an updated process design kit for ...

Long-Term Collaboration Supports Industry Transition to Interoperable PDK; First Development Milestone Delivers SpringSoft Laker 65nm CMOS PDK HSINCHU, Taiwan -- June 22, 2009 -- SpringSoft, Inc.

MOUNTAIN VIEW, Calif., Nov. 7, 2018 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced that, in conjunction with the American Institute for Manufacturing Integrated Photonics (AIM Photonics ...

South Korean vendor MagnaChip Semiconductor announced yesterday a process design kit that supports Agilent's RF Design Environment (RFDE) EDA software. The kit covers the full frequency range of ...

New Offering Enables Fast, Accurate and Reliable Photonic IC Designs with On-Chip Laser Technology MOUNTAIN VIEW, Calif., Nov. 22, 2022 /PRNewswire/ -- To streamline the end-to-end design of photonic ...

A joint effort between Mentor Graphics and Taiwan Semiconductor Manufacturing Company (TSMC) has resulted in foundry-qualified process design kits (Mentor-PDKs) that support Mentor's entire ...

MOUNTAIN VIEW, Calif., March 1, 2023 /PRNewswire/ -- To enhance familiarity with process technologies and increase the accessibility of photonic integrated circuits (PICs), OpenLight today announced ...

MOUNTAIN VIEW, Calif., Nov. 22, 2022 /PRNewswire/ -- To streamline the end-to-end design of photonic integrated circuits (PICs) and meet future demands of applications including datacom, telecom, ...