Amkor Technology Inc. today unveiled a high-density manufacturing process that it claims changes the way leadframe-based ICs are packaged and assembled. The Chandler, Ariz.-based company’s (nasdaq: ...

A packaging process developed by Amkor Technology of Chandler, Ariz., is being described by the company as the packaging equivalent of a semiconductor move from 200- to 300-mm wafers. The company's ...

3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...

The manufacture of automotive ICs will continue to rely mainly on mature process technologies, according to Denise Lee, senior consultant at McKinsey. Speaking at a forum during the ongoing SEMICON ...

Informed consent (IC) struggles to meet the ethical principles it strives to embody in the context of hematopoietic cell transplantation (HCT). Patients often participate in multiple clinical trials ...

IC design houses are hesitant to place orders for mature process manufacturing with foundries, due to the still uncertain market outlook for the second half of this year, according to industry sources ...

Verification Suite Streamlines IC Design Process Designed specifically for IC designers using hardware-assisted verification platforms, the Emulation Edge verification suite speeds the functional ...

SAN FRANCISCO--(BUSINESS WIRE)--Project Frog, a leader in developing scalable Industrialized Construction (IC) solutions with an integrated building system product and technology approach, today ...