TOKYO, Feb. 12, 2025 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced the T5801 Ultra-High-Speed DRAM Test System. The cutting-edge ...

NORTH READING, Mass.--(BUSINESS WIRE)--Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, is proud to announce the launch of the Magnum 7H, a ...

Teradyne TER is benefiting from the growing demand for memory test solutions, particularly driven by advancements in AI ...

The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions. AI-driven applications are fueling significant year-over-year growth in ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...

Delivers complete design and validation solution for Low-Power Double Data Rate 6 (LPDDR6) memory in mobile, client computing, and AI applications. Supports JEDEC’s ongoing development of the new ...

Micron Technology, Inc. has commenced the construction of a High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, the first of its kind in the country. The groundbreaking ceremony ...