In 2001, IBM patented a method of using a double bump material structure to make a reliable joint between a chip and its package for bump pitch below 150 µm. 1 This invention improved the existing ...

A very basic example of this can be noted in certain oldest applications of finite elements. More than 2000 years earlier, geometers were keen on finding out the circumference and area of a circle.

Researchers have developed an innovative approach to predict the working status of high-formwork support systems (HFSS) by combining finite element model (FEM) simulations with deep learning and large ...