CAMBRIDGE, Mass. — Among the number of provocative points that Dan Geer, the CISO of In-Q-Tel, makes about embedded systems and supply chain risk, one stands out: The systems are immortal. They are ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

The LEC-3517 Smart Mobility Architecture (SMARC) form-factor computer-on-module (COM), built on a Texas Instruments AM3517 system-on-a-chip, integrates a 600-MHz ARM Cortex-A8 processor and features a ...

2. Asking the right questions will help lead designers down a path to the best small form factor for their applications. Small form factors, in general, play one of the greatest roles in connected ...