2008 - PACE Award Winner Webasto AG What: Low Pressure Injection-Compression Process for Panoramic Polycarbonate Roof Module Judge's Citation: OEMs are increasingly eager to substitute polycarbonate ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

Many of today's embedded systems are providing more sophisticated solutions to a wide variety of applications and industries. With this increase in sophistication, there is a corresponding increase in ...