SiSiC (reaction bonded silicon carbide, also known as RBSIC) grinding buckets are engineered to handle severe mechanical wear, impact, and chemical exposure. Compared with metal, polymer-lined, or ...

Device level SiC wafers require a systematic process including single crystal growth, wire cutting, lapping or grinding, and chemical mechanical polishing. SiC wafers have important application value ...

Silicon carbide is for photonic circuits and quantum devices. Atomic layer processing boosts SiC waveguides and resonators, improving performance.

Silicon carbide (SiC) is a promising material platform for photonic integrated circuits (PICs) and miniaturized solid-state quantum systems. In the ALP-4-SiC project, researchers from the Max Planck ...

Researchers from the Max Planck Institute for the Science of Light and the Fraunhofer Institute for Integrated Systems and Device Technology IISB are advancing silicon carbide as a key material ...