A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...

Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...

For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of dielectrics and metal layers. CMP ...

Geneva, June 15, 2011 - STMicroelectronics (NYSE: STM) and CMP (Circuits Multi Projets®) today announced that the CMOS 28nm process from STMicroelectronics is now available for prototyping to ...

Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in ...

“There has been a great interest in designing ICs in these processes, with about 300 projects having been designed in 90nm (phased out in 2009), and 200 already in 65nm,” said Bernard Courtois, ...

Suppliers of chemical mechanical planarization (CMP) slurries may be fierce competitors of Cabot Microelectronics, the company considered to be the sector's number one player, but they agree with the ...

In semiconductor manufacturing, the chemical mechanical polishing (or CMP) step is used to planarize, or create a level topography, between each layer of the interconnect structure as the device is ...

Novellus Systems Inc. says it has taken what was good about SpeedFam-IPEC's technology and fixed what wasn't with Xceda. The Silicon Valley-based back-end-of-line process tool vendor today unveiled ...

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/n63tp6/cmp_consumables) has announced the addition of the "CMP Consumables ...