SANTA CLARA, Calif., March 3, 2010 — Agilent Technologies Inc. (NYSE: A) today announced that its Advanced Design System (ADS) software has been selected by Paratek Microwave for use in development of ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers, and governments accelerate innovation to connect ...

Keysight Technologies, Inc. launched its two electromagnetic (EM) software solutions designed to help signal integrity (SI) and power integrity (PI) engineers improve high-speed link performance in ...

How embedded technology is advancing military operations. Why open standards are crucial to today’s electronics systems. The importance of a unified infrastructure across critical communication ...

May 13, 2014. Agilent Technologies Inc. has announced that GIT Japan Inc., a provider of advanced interface technologies between people and information and a competence center for ultrawideband (UWB) ...

LANDSHUT, Germany & MUNICH--(BUSINESS WIRE)--LFoundry today announced the availability of an OpenAccess (OA) based interoperable process design kit (iPDK) for high performance analog and RF design ...

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

Growing momentum for advanced packaging is shifting design from a die-centric focus toward integrated systems with multiple die, but it’s also straining some EDA tools and methodologies and creating ...