Process control is moving forward as quickly as data collection and processing can carry it, and a recent research effort demonstrated how fast and flexible, and adaptive, machining operations can be.

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Jon Herlocker, co-founder and CEO of Tignis, sat down with Semiconductor Engineering to talk about how AI in advanced process control reduces equipment variability and corrects for process drift. What ...

How self-tuning can support an adaptive control strategy. How Model Reference Adaptive Control can improve adaptability. The different types of MRAC. A certain amount of flexibility is always good to ...